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STM32: Package and board features are too closely coupled #2195

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hierophect opened this issue Oct 3, 2019 · 1 comment
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STM32: Package and board features are too closely coupled #2195

hierophect opened this issue Oct 3, 2019 · 1 comment
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@hierophect
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Current implementation of the STM32 has too much overlap of features that are related to a specific MCU package (such as pin definitions, available peripherals, etc) vs a specific development boards (Status LEDs, clock settings, debugging availability).

All features that are directly related to the board should be sorted to the board module, leaving only MCU-specific features in the peripherals directory. Additionally, a better package/pin sorting system should be implemented in the Microcontroller module, to support the very large variety of packages available for most STM32 MCUs.

@hierophect hierophect self-assigned this Oct 3, 2019
@hierophect hierophect added the stm label Oct 3, 2019
@dhalbert dhalbert added this to the Long term milestone Oct 31, 2019
@hierophect hierophect removed their assignment Nov 1, 2019
@hierophect
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Resolved by #2735

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